Abstract
Infrared Nanosecond Laser Drilling equipment Large-Format for Glass
Substrates
The infrared nanosecond laser glass drilling system is an advanced
manufacturing platform that utilizes 1064 nm infrared nanosecond
pulsed lasers to achieve high-precision and high-efficiency
micro-hole processing on glass substrates. By employing short
pulses (1-100 ns) with high energy density, the system combines
photothermal ablation and mechanical shock mechanisms to produce
micron-scale apertures (20-500 μm) while effectively minimizing the
heat-affected zone (HAZ) and preventing material cracking or edge
chipping.
Compared to conventional mechanical drilling or CO₂ laser
processing, this technology offers distinct advantages, including
non-contact operation, zero tool wear, and exceptional flexibility,
making it particularly suitable for complex micro-hole formation in
ultra-thin glass and high-hardness brittle materials (e.g., quartz,
sapphire glass). Key applications span consumer electronics (camera
cover lenses, displays), photovoltaics (solar cells), automotive
sensors, and medical microfluidic devices. The system is typically
equipped with a large-format motion platform (e.g., ≥600×600 mm)
and high-speed galvanometer scanning, enabling automated batch
production with optimized throughput (hundreds of holes per second)
and cost efficiency. As such, it has emerged as a critical
technology in modern precision glass machining.
Main parameter
| Laser type | Infrared nanosecond |
| Platform size | 800*600(mm) |
| 2000*1200(mm) |
| Drilling thickness | ≤20(mm) |
| Drilling speed | 0-5000(mm/s) |
| Drilling edge breakage | <0.5(mm) |
| Note: Platform size can be customized. |
Working Principle
1. Laser Generation: The system employs laser sources (e.g., Nd:YAG
or fiber lasers) to generate infrared light at 1064 nm wavelength
with nanosecond-scale pulse durations (1ns = 10ns).
2. Energy Focusing: The laser beam is concentrated into
micron-scale spots via optical systems (e.g., galvanometers and F-θ
lenses), achieving extremely high energy density (up to GW/cm²
level).
3. Material Interaction: Nanosecond pulsed lasers interact with
glass through photothermal and photomechanical effects:
· Photothermal Effect: Laser energy absorption induces localized
heating, causing material melting or vaporization.
· Photomechanical Effect: Short pulses generate shockwaves that
produce micro-explosive fractures, forming cavities.
4. Layer-by-Layer Removal: Controlled pulse counts and scanning
paths enable precise material ablation, creating high-accuracy
holes.
Technical Features
1. High Precision: Hole diameters of 20-500 μm, depths up to
several millimeters, with wall roughness (Ra) <1 μm.
2. Non-Contact Processing: Eliminates mechanical stress, ideal for
brittle glass (e.g., quartz, borosilicate).
3. Controlled Thermal Impact: Nanosecond pulses minimize heat
diffusion, preventing edge cracks (vs. millisecond lasers).
4. High Flexibility: Capable of forming complex geometries (round,
square, tapered holes) and micro-hole arrays.
Process Applications
Suitable for drilling, grooving, film removal, and surface
texturing of brittle/hard materials, including:
1. Drilling and notching for shower door panels;
2. Hole drilling for appliance glass;
3. Solar panel perforation;
4. Switch/socket cover drilling;
5. Mirror film removal and drilling;
6. Custom grooving and surface texturing;
Advantages
1. Large-format platform accommodates diverse product sizes across
industries.
2. Complex hole geometries achieved in single-step processing.
3. Minimal edge chipping with smooth machined surfaces.
4. Seamless transition between product specifications;
user-friendly operation.
5. Low operating costs, high yield, no consumables, and
pollution-free.
6. Non-contact processing prevents surface scratches.
Machining effect——Sample display
