High-Temperature Resistant SiC Backing Plate/Support Plate for
Wafer Carriers
Silicon Carbide (SiC) Backing Plates / Support Plates are
high-performance ceramic components widely used in advanced
manufacturing sectors such as semiconductors, LEDs, and
photovoltaics. Renowned for their exceptional thermal resistance,
corrosion resistance, high thermal conductivity, and rigidity, they
are ideal for precision processes. ZMSH provides customized SiC
Backing Plate solutions, including design, manufacturing, testing,
and after-sales support, ensuring enhanced process stability and
production efficiency.
Technical specification:
| Parameter | Specification | Unit | Notes |
| Material Type | CVD-SiC / RBSiC / HPSiC | - | Optional |
| Diameter | 100-500 (Customizable) | mm | Custom |
| Thickness | 10-50 | mm | Adjustable |
| Max Operating Temperature | 1650 | °C | Long-term |
| Thermal Conductivity | 120-200 | W/m·K | At 25°C |
| Thermal Expansion Coefficient | 4.0×10⁻⁶ | /°C | RT-1000°C |
| Density | 3.10-3.21 | g/cm³ | Theoretical |
| Porosity | <0.5% | - | Dense |
| Surface Roughness (Ra) | <0.2 (Polished) | μm | Mirror finish |
| Flatness | ≤0.05 | mm/100mm | Precision grade |
| Hardness (Mohs) | 9.2 | - | Second only to diamond |
| Bending Strength | 350-450 | MPa | 3-point |
| Purity | >99.9995% | - | Semiconductor grade |
SiC Backing Plate / Support Plate – Key Characteristics
1. High-Temperature Resistance – Stable operation above 1600°C, suitable for extreme process
conditions.
2. Superior Thermal Conductivity – Outperforms traditional materials (e.g., graphite, alumina) for
rapid heat dissipation and reduced thermal stress.
3. Low Thermal Expansion – Excellent dimensional stability at high temperatures, minimizing
warpage.
4. High Hardness & Wear Resistance – Mohs hardness of 9.2, ensuring long-term durability.
5. Chemical Inertness – Resistant to acids, alkalis, and corrosive environments (e.g.,
etching, CVD/PVD).
6. High Purity – Metal-free composition, meeting stringent semiconductor industry
standards.
Primary applications of SiC Backing Plate / Support Plate
1. Process Compatibility
· Semiconductor Manufacturing – Compatible with CVD, MOCVD, and epitaxial growth, ensuring
uniform wafer heating.
· LED Production – Supports sapphire substrates for consistent epitaxial layer
growth.
· Photovoltaics – Used in high-temperature sintering & thin-film deposition.
· Precision Machining – Suitable for laser cutting, plasma etching, and other
high-accuracy processes.
2. Material Types
· Reaction-Bonded SiC (RBSiC) – Cost-effective, ideal for general high-temperature use.
· Chemical Vapor Deposition SiC (CVD-SiC) – Ultra-high purity for advanced semiconductor processes.
· Hot-Pressed SiC (HPSiC) – High density & strength for heavy-load applications.
3. Core Applications
· Wafer/Substrate Support – Ensures uniform thermal distribution in processing.
· Graphite Replacement – Eliminates oxidation and particle contamination risks.
· Etching Equipment – Provides stable plasma environment support.
ZMSH Services – Comprehensive SiC Backing Plate / Support Plate
Solutions
1. Custom Design – Optimized dimensions, geometry, and surface
treatments (e.g., polishing, coatings).
2. Precision Manufacturing – Advanced sintering/CVD techniques for
high consistency & reliability.
3. Rigorous Testing – Ultrasonic inspection, thermal cycling, and
quality assurance protocols.
4. Rapid Response – Technical consultation, prototyping, and batch
production support.
5. Global Support – Worldwide coverage (Asia-Pacific, Europe,
Americas) with 24/7 after-sales service.
Q&A
