TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via
(TGV) Customized
The TGV sapphire wafer with laser-drilled apertures is an advanced
substrate material fabricated by forming high-precision
through-glass vias (TGV) on single-crystal sapphire (Al₂O₃)
substrates via laser or etching processes. It combines sapphire’s
exceptional hardness, high-temperature resistance, and optical
transparency with TGV’s micro/nano-structuring capabilities.
Technical parameters
| Specification | Value |
| Glass Thickness | <1.1 mm |
| Wafer Sizes | All standard up to 200 mm |
| Minimum Microhole Diameter | 10 µm |
| Identical Hole Diameter | 99% |
| Positional Accuracy | ±3 µm |
| Chipping | None |
| Super Smooth Sidewalls | RA < 0.08 µm |
| Hole Types | Through Via (True circle or Ellipse), Blind Via (True circle or
Ellipse) |
| Hole Shape | Hourglass |
| Option | Singulation from hole-processed large-sized glass |
Key Features
- High Mechanical Strength: Mohs hardness of 9, scratch-resistant, and corrosion-resistant.
- Superior Thermal Stability: Withstands extreme temperatures (>2000°C) and exhibits low
thermal expansion.
- Precision Through-Holes: Laser/photolithography enables micron-scale apertures with high
aspect ratios.
- Optical Performance: Broadband transparency (80%+ @400-5000nm) from UV to IR
wavelengths.
- Dielectric Properties: Excellent insulation (resistivity >10¹⁴ Ω·cm).
Applications
- Semiconductor Packaging: Heterogeneous integration substrate for 3D ICs and MEMS sensors
(e.g., pressure/inertial sensors).
- Optoelectronic Devices: Transparent interposer for Micro-LEDs and vertical-cavity
surface-emitting lasers (VCSELs).
- RF Components: 5G/mmWave antenna packaging (low dielectric loss).
- Biochips: Chemically inert transparent layer for microfluidic chips.
- Extreme-Environment Sensors: Aerospace and deep-well sensor windows.
Machining effect
Our advanced TGV wafers are engineered to enable high-performance
metallization of microvias, ensuring optimal conductivity and
structural integrity for cutting-edge applications.
We specialize in manufacturing TGV wafers with bespoke dimensions
and microvia designs, tailored to seamlessly integrate with your
preferred metallization processes—whether electroless plating,
sputtering, or electroplating.
Product display
Our TGV glass wafers are precision-fabricated to deliver
exceptional surface quality, enabling direct integration into your
production workflow with minimal post-processing. High-density
microvia arrays are uniformly distributed to meet stringent
industry standards.
From concept to commercialization, we provide agile prototyping and
high-volume production services to support your unique design
requirements. Our flexible manufacturing capabilities ensure fast
turnaround without compromising precision or reliability.
Q&A
