Chip loading transport box chiplets packaging box Self-absorbing
plastic box
Chip boxes (IC chip storage boxes) are specialized vehicles for the
secure storage, transportation and automated sorting of
semiconductor chips (dies) or packaged IC devices, typically made
of antistatic engineering plastics (such as PC, ABS, PPS) or
conductive composites. Its core function is to protect the chip
from mechanical damage, electrostatic discharge (ESD) and
environmental pollution, and it is widely used in packaging and
testing (OSAT), chip Sorting, SMT and terminal electronic product
assembly.
Technical specifications
Chip packaging box /IC storage box is a key auxiliary material to
ensure the high yield and high reliability of semiconductor
devices. ZMSH provides customized storage and transportation
solutions for packaging factories, SMT manufacturers and end
customers through precision design and clean manufacturing.
Materials: | PC, ABS, PPS |
Surface resistance: | 10⁴~10⁹Ω |
| Particle control: | <0.3μm |
| Transport vibration: | <1G@5-500Hz |
Function: | Protect the chip from mechanical damage |
Application: | Package test, chip sorting |
Characteristic of Chip loading transport box
1. Anti-static protection:
- Surface resistance 10⁴~10⁹Ω (in accordance with ANSI/ESD S20.20)
to avoid electrostatic damage to the sensitive chip.
** conductive (<10⁴Ω) or dissipative (10⁶~10⁹Ω) ** materials are
available.
2. High clean design:
- Low Outgassing material that prevents organic contaminants from
adsorbing to the chip surface.
- Particle control <0.3μm to meet Class 1000 clean room
requirements.
3. Precision structure adaptation:
- Support QFN, BGA, CSP, SOT and other packaging forms of
customized cavity design.
- Shockproof cushioning structures (e.g. elastic silicone gaskets),
transport vibration <1G@5-500Hz.
4. Automation compatibility:
- Standardised sizes (such as JEDEC standard trays) for Pick &
Place equipment.
- Optional RFID/ barcode tags for chip batch traceability.
Application of Chip loading transport box
(1) Package Testing (OSAT)
Die Sorting: carry the Bare Die after cutting, cooperate with the
sorting machine (Handler) for testing and sorting.
Pre-taping & Reeling: to avoid chip contamination or collision
damage prior to packaging.
(2) SMT placement and assembly
SMT production line feed: As an alternative to IC carrier belts
(TRAYS), suitable for small batch, multi-variety production.
High value chip storage: ESD temporary storage for cpus, Gpus, and
memory chips.
(3) Manufacturing of terminal electronic products
Mobile/automotive electronics modules: Protect sensitive devices
such as radio frequency chips (RF ics) and sensors (MEMS).
Military and aerospace: Meet high reliability storage requirements
(such as -55 ° C to 125 ° C temperature cycle).
(4) Special scenarios
Optoelectronic devices: such as laser diode (LD), VCSEL chip dust
storage.
Medical electronics: aseptic packaging solutions for biosensor
chips.
Q&A
