4inch SSP sapphire wafer quartz glass thickness 0.1mm 0.15mm 0.2mm
4inch 100um 200um 300um thickness sapphire wafer quartz glass
4inch Sapphire Wafer C-Plane Single or Double Side Polished Al2O3
Single Crystal
4inch Dia100mm A plane Single Crystal Sapphire Wafer
2inch Dia50mm C axis Single Crystal Sapphire Wafer Sapphire
Substrates
8inch Dia 159mm Single Crystal Sapphire Wafer For Epi - Ready
Carrier
4inch/ 5inch/ 6inch/ 6.125inch/8inch c-plane R-axis (1-102) (10-10)
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Al2O3 crystal optical lens, Double Side Polished SSP Surface 8"
Sapphire Carrier Wafer C-plane(0001) with best price,8inch Dia
159mm Single Crystal Sapphire Wafer For Epi - Ready Carrier
Characteristics of ZMSH’s sapphire substrate
Specifications of Sapphire Wafer, 4 inch, C-plane (0001), Prime Grade
| Item | 4-inch C-plane(0001) 650μm Sapphire Wafers |
| Crystal Materials | 99,999%, High Purity, Monocrystalline Al2O3 |
| Grade | Prime, Epi-Ready |
| Surface Orientation | C-plane(0001) |
| C-plane off-angle toward M-axis 0.2 +/- 0.1° |
| Diameter | 100.0 mm +/- 0.1 mm |
| Thickness | 650 μm +/- 25 μm |
| Primary Flat Orientation | A-plane(11-20) +/- 0.2° |
| Primary Flat Length | 30.0 mm +/- 1.0 mm |
| Single Side Polished | Front Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
| (SSP) | Back Surface | Fine ground, Ra = 0.8 μm to 1.2 μm |
| Double Side Polished | Front Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
| (DSP) | Back Surface | Epi-polished, Ra < 0.2 nm (by AFM) |
| TTV | < 20 μm |
| BOW | < 20 μm |
| WARP | < 20 μm |
| Cleaning / Packaging | Class 100 cleanroom cleaning and vacuum packaging, |
| 25 pieces in one cassette packaging or single piece packaging. |
Electrical Properties of Sapphire
Resistivity, Ohm x cm at 200-500 °C: 1011- 1016
Dielectric constant: 10.0
Dielectric strength, V/cm: 4 x 105
Loss tangent: 1 x 10-4
Application
Some key properties of sapphire wafers include their high thermal
conductivity, high mechanical strength, excellent chemical and
scratch resistance, and transparency in the visible and
near-infrared regions of the spectrum. These properties make
sapphire wafers well-suited for a wide range of applications in
harsh environments, such as high temperature, high pressure, and
corrosive conditions.
What is the roughness of sapphire substrate?
Our 'Standard' sapphire substrates have been polished to a surface
quality of 60/40 scratch-dig, have an RMS roughness of ~0.3 nm, and
are suitable for most applications (including spectroscopy or
thin-film deposition).
Production process
1. Crystal growth: Single-crystal sapphire is typically grown using
the Verneuil method or the Kyropoulos method. In the Verneuil
method, a powdered form of aluminum oxide (Al2O3) is melted using a
high-temperature flame and then allowed to cool and solidify into a
single crystal. In the Kyropoulos method, a seed crystal is dipped
into a bath of molten Al2O3 and slowly withdrawn while rotating,
allowing the crystal to grow from the melt.
2. Cutting and shaping: Once the crystal has been grown, it is cut
into wafers using a diamond saw or laser. The wafers are then
shaped and polished to the desired thickness and surface finish.
3. Cleaning: The sapphire wafers are cleaned using a combination of
mechanical, chemical, and ultrasonic methods to remove any surface
contaminants and prepare the surface for further processing.
4. Doping: In some cases, dopants may be added to the sapphire
wafers to alter their electrical or optical properties. This is
typically done using ion implantation or diffusion methods.
5. Etching: The sapphire wafers may be etched using a variety of
chemical or plasma-based processes to create patterns or features
on the surface. This is commonly used in the fabrication of
microelectronic devices.
6. Metrology: The sapphire wafers are then subjected to various
metrology techniques to measure their thickness, flatness, surface
roughness, and other properties. This is important to ensure that
the wafers meet the required specifications for the intended
application.
7. Packaging: The final step in the production process is to
package the sapphire wafers for shipment to customers. This
typically involves placing the wafers in protective containers to
prevent damage during transportation and storage.
Packing of sapphire wafers
Related products
FAQ:
Q: What's your MOQ?
A: (1) For inventory, the MOQ is 10pcs.
(2) For customized products, the MOQ is 25pcs up.
Q: What's the way of shipping and cost?
A:(1) We accept DHL, Fedex, EMS etc.
(2) If you have your own express account, it's great.If not,we
could help you ship them.
Freight is in accordance with the actual settlement.
Q: What's the delivery time?
For inventory: the delivery is 5 workdays after you place the
order.
For customized products: the delivery is 2 or 3 weeks after you
place the order.
Q: Do you have standard products?
A: Our standard products in stock.as like 4inch 0.65mm,0.5mm
polished wafer.
Q: How to pay?
A:50％deposit, left before delivery T/T,
Q: Can I customize the products based on my need?
A: Yes, we can customize the material, specifications and optical
coating for your optical
components based on your needs.
