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HVPE Gallium Nitride GaN Wafer , Gan Chip Free Standing 10 x 10 mm Size

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    Buy cheap HVPE Gallium Nitride GaN Wafer , Gan Chip Free Standing 10 x 10 mm Size from wholesalers
     
    Buy cheap HVPE Gallium Nitride GaN Wafer , Gan Chip Free Standing 10 x 10 mm Size from wholesalers
    • Buy cheap HVPE Gallium Nitride GaN Wafer , Gan Chip Free Standing 10 x 10 mm Size from wholesalers
    • Buy cheap HVPE Gallium Nitride GaN Wafer , Gan Chip Free Standing 10 x 10 mm Size from wholesalers

    HVPE Gallium Nitride GaN Wafer , Gan Chip Free Standing 10 x 10 mm Size

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    Brand Name : zmsh
    Model Number : GaN-001
    Price : by case
    Payment Terms : L/C, , T/T
    Supply Ability : 10PCS/month
    Delivery Time : 2-4weeks
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    HVPE Gallium Nitride GaN Wafer , Gan Chip Free Standing 10 x 10 mm Size

    2inch HVPE method Gallium Nitride GaN wafer ,free standing GaN substrates for LD,10x10mm size GaN chips,HVPE GaN wafer


    About GaN Feature Introduce

    The growing demand for high-speed, high-temperature and high power-handling capabilities has madethe semiconductor industry rethink the choice of materials used as semiconductors. For instance,

    as various faster and smaller computing devices arise, the use of silicon is making it difficult to sustain Moore’s Law. But also in power electronics, So GaN semiconductor wafer is grown out for the need.

    Due to its unique characteristics (high maximum current, high breakdown voltage, and high switching frequency), Gallium Nitride GaN is the unique material of choice to solve energy problems of the future. GaN based systems have higher power efficiency, thus reducing power losses, switch at higher frequency, thus reducing size and weight.

    GaN technology is used in numerous high-power applications such as industrial, consumer and server power supplies, solar, AC drive and UPS inverters, and hybrid and electric cars. Furthermore,

    GaN is ideally suited for RF applications such as cellular base stations, radars and cable TV

    infrastructure in the networking, aerospace and defense sectors, thanks to its high breakdown strength,low noise figure and high linearity.




    Specifications for GaN Substrates


    2”GaN Substrates
    ItemGaN-FS-NGaN-FS-SI
    DimensionsФ 50.8mm ± 1mm
    Marco Defect DensityA Level≤ 2 cm-2
    B Level> 2 cm-2
    Thickness330 ± 25 µm
    OrientationC-axis(0001) ± 0.5°
    Orientation Flat(1-100) ± 0.5°, 16.0 ± 1.0mm
    Secondary Orientation Flat(11-20) ± 3°, 8.0 ± 1.0mm
    TTV(Total Thickness Variation)≤15 µm
    BOW≤20 µm
    Conduction TypeN-typeSemi-Insulating
    Resistivity(300K)< 0.5 Ω·cm>106 Ω·cm
    Dislocation DensityLess than 5x106 cm-2
    Useable Surface Area> 90%
    PolishingFront Surface: Ra < 0.2nm. Epi-ready polished
    Back Surface: Fine ground
    PackagePackaged in a class 100 clean room environment, in single wafer containers, under a nitrogen atmosphere.

    P-GaN on Sapphire

    GrowthMOCVD / HVPE
    ConductivityP type
    DopantMg
    Concentration> 5E17 cm-3
    Thickness1 ~ 5 um
    Resistivity< 0.5 ohm-cm
    SubstrateØ 2" / Ø 3" / Ø 4" Sapphire wafer

    Applications

    1. - Various LED's: white LED, violet LED, ultraviolet LED, blue LED
    2. - Environmental detection
    3. Substrates for epitaxial growth by MOCVD etc
    4. - Laser diodes: violet LD, green LD for ultra small projectors.
    5. - Power electronic devices
    6. - High frequency electronic devices
    7. Laser Projection Display, Power Device, etc.
    8. Date storage
    9. Energy-efficient lighting
    10. High- Efficiency Electronic devices
    11. New energy solor hydrogen technology
    12. Light source terahertz band

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